What is Laser reballing?

Solder ball reflow is performed by a laser system using an infrared wavelength. All components of the system are integrated into a single cabinet. Retronix are the only company to offer Laser Reballing service, mitigating the need for an additional reflow thus protecting the device.

What is BGA reballing stencil?

Ball grid arrays (BGAs) are an essential and complex component of electronics. They provide crucial thermal conductivity, package density and resistance to interference. BGA stencils are critical tools for making the reballing process run smoother.

What is meant by reballing?

Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using …

Why is reballing needed?

Jaywn, reballing is usually performed to replace a BGA IC, not a device. It has become somewhat more accepted to reflow devices like PS3 XBox etc. Most of the time a reflow is based on generally known failures. It is the thermal cycling that causes the following in Lead-Free Solder over time.

Why Reballing is done?

There are mainly four different reason why a BGA chip needs reballing and those 4 reasons are: Just because of overuse or long running time period of the Graphic Chip, the solder joints between the Chip and PCB becomes loose and create’s display related problems. Sometimes, PCB motherboard needs a BGA Chip Upgradation.

How do I become a BGA IC?

1. Step 1: Deball the Device.
2. Step 2: Clean the Deballed Part.
3. Step 3: Apply Paste Flux.
4. Step 4: Put Preform Ball Side Up.
5. Step 5: Carefully Place Device on Top of Preform.
6. Step 6: Square Up Preform to Device.
7. Step 7: Reflow.
8. Step 8: Remove Preform.

Why is IC reballing?

IC Reball is a kind of rework technique, which is used to repair faulty circuit board components such as ICs, resistors, capacitors etc. It also can be used to diagnose and repair PCBs. Reballing is mainly used for BGA and PGA chips with BGA balls cracked or missing that are unrepairable by other means.